| 发明名称 |
Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold |
| 摘要 |
A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.
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| 申请公布号 |
US2004224535(A1) |
申请公布日期 |
2004.11.11 |
| 申请号 |
US20040771252 |
申请日期 |
2004.02.03 |
| 申请人 |
TESSERA, INC. |
发明人 |
LIGHT DAVID;BEROZ MASUD |
| 分类号 |
H01L21/56;H01L21/68;H01L23/31;(IPC1-7):H01L21/469 |
主分类号 |
H01L21/56 |
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