Arrangement for handling, especially gripping parts e.g. circuit boards, has first gripping module movable relative to second axis perpendicular to first axis, and second/third gripping modules movable parallel to first axis

摘要

The arrangement (100) has at least one first gripping module (30) for gripping the part (200) along a first extent essentially parallel to a first axis, at least one second module (32) for gripping along a second extent parallel to a second axis perpendicular to the first axis and/or at least one third module for gripping along a third extent parallel to the second axis. The first module is movable relative to a second axis and the second and/or third modules are movable parallel to the first axis. Independent claims are also included for the following: (a) a method of handling, especially gripping, parts to be handled (b) and the use of at least one arrangement for separating at least one housing frame with at least one circuit board from the residual material of the circuit board.