| 发明名称 |
RESIN COMPOSITION AND ADHESIVE FILM |
| 摘要 |
<p>A resin composition excellent in hygroscopicity, thermal resistance, adhesion, electric characteristics and moldability and suitable for use as an insulating material for multilayer wiring boards and electric components; and adhesive films. The resin composition comprises (A) a polymer having a quinoline ring of the general formula (1) in a structure of, for example, 6,6'-bis(2-(4- fluorophenyl)-4-phenylquinoline) or 4,4'-(1,1,1,3,3,3-hexafluoro-2,2-propylidene) bisphenol and (B) a bismaleimide compound of the general formula (2), such as 2,2-bis((4-maleimidophenoxy) phenyl)propane.</p> |
| 申请公布号 |
WO2004096919(A1) |
申请公布日期 |
2004.11.11 |
| 申请号 |
WO1998JP01587 |
申请日期 |
1998.04.07 |
| 申请人 |
SUZUKI, MASAHIRO;NISHIMURA, SHIN;HONDA, YOSHIHIKO;SUZUKI, MASAO;TAKAHASHI, AKIO;KAGEYAMA, AKIRA;KAWAI, TOSHIYASU;IIOKA, SHINJI;NOMURA, YOSHIHIRO |
发明人 |
SUZUKI, MASAHIRO;NISHIMURA, SHIN;SUZUKI, MASAO;TAKAHASHI, AKIO;KAGEYAMA, AKIRA;HONDA, YOSHIHIKO;KAWAI, TOSHIYASU;IIOKA, SHINJI;NOMURA, YOSHIHIRO |
| 分类号 |
C08G75/23;C08G65/40;C08L71/00;(IPC1-7):C08L101/00;C08L79/04;C09J179/04;C08K5/341;C09J201/00;C09J7/00;C08G73/12 |
主分类号 |
C08G75/23 |
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