| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can conduct stress relaxation at trench corners without reducing the area of an active region or the transistor width or stably form the resistance of a semiconductor substrate or a well of opposite conductivity type from that of the semiconductor substrate, in element isolation using an STI (shallow trench isolation) method. SOLUTION: Oxygen ions are implanted into an internal region 16 of a semiconductor substrate 11 containing a bottom 22 of a shallow groove 15 prior to forming the shallow groove 15 in an element isolation region 18 of the semiconductor substrate 11, and annealing is performed in a non-oxidizing atmosphere such as a nitride atmosphere or a vacuum atmosphere after forming the shallow groove 15 in the semiconductor substrate 11. COPYRIGHT: (C)2005,JPO&NCIPI
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