PROBE CARD, PROBE PIN, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a prove card having probe pins dealing with an LSI with high integration density, or probe pins which deals with an arrangement of an electrode pad in which a step difference on a chip is more than several tens ofμm such as an MEMS device. SOLUTION: Glass with feed-through or a Si substrate as a starting substrate, probe pins for a probe card are formed by photo-lithography and plating. The probe pins are electrically connected to a multilayer wiring substrate, fixed and integrated into the probe card. COPYRIGHT: (C)2005,JPO&NCIPI