| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip capable of contracting the chip size thereof. <P>SOLUTION: In the semiconductor chip 1 equipped with a multitude of bonding pads 100, 101 arrayed in one row on the peripheral parts of the chip as input-and-output interfaces, an up-and-down stage difference is provided between neighbored bonding pads 100, 101. Further, the bonding pads 100 formed on the upper stage are arranged so as to be deviated toward inside of the semiconductor chip 1 compared with the bonding pads 101 formed on the lower stage. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
