| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for removing solder scrap adhering to the external terminal of a semiconductor. SOLUTION: Solder scrap 18 adhering to a lead 52 is removed by irradiating the lead 52, along the circumference or the vicinity thereof, with a laser light having a laser marker of lower output than that for cutting a metal. COPYRIGHT: (C)2005,JPO&NCIPI |
