| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device and its performance test method capable of efficiently testing performance before assembling in an SIP which a plurality of semiconductor chips are connected with bumps and testing connection state and the like with a bump also after assembling. SOLUTION: A first semiconductor chip 1 having a first semiconductor integrated circuit 10 and a first test circuit 11 capable of performance test of the first semiconductor integrated circuit by way of the first test circuit from a pad connected to the first test circuit, and a second semiconductor chip 2 having a second semiconductor integrated circuit 20 and a second test circuit 21 capable of performance test of the second semiconductor integrated circuit by way of the second test circuit from a pad connected to the second test circuit, are SIP connected with a bump BP. The device is constituted to be able to test the connection state of the first test circuit and the second test circuit by the bump by way of a pad connecting with the second test circuit, the second test circuit, the bump and the first test circuit. COPYRIGHT: (C)2005,JPO&NCIPI
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