| 摘要 |
PROBLEM TO BE SOLVED: To secure sufficient adhesion strength for a load in any direction operating on a lead. SOLUTION: In a surface mounted component 10 having the lead 15 projecting from a side of a package 20, at least one constricted part 17 is formed in a lead foot part 16 at a tip part of the lead 15. At the time of mounting it on a printed board 30 by solder paste 35, the constricted part 17 is surrounded by solder paste 35. COPYRIGHT: (C)2005,JPO&NCIPI |
