| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic apparatus circuit device in which high productivity essential to reflow processing can be ensured by a simple process in correspondence with reduction in the size of components or complicacy in the shape of the components. SOLUTION: In order to manufacture an electronic apparatus circuit device by mounting an electronic component 32 through soldering on a circuit board 31 produced by forming a circuit pattern on the surface 21 of a metal base 20 having uneven thickness between the front surface 21 and the rear surface 22, a first stage comprising a step for adding solders having different melting points to respective surface areas of the circuit board having a different thickness between the front surface 21 and the rear surface 22 while spacing apart from each other and a step for mounting the electronic component 32, a second stage for heating the metal base 20 having the circuit board 31 in the first state, and a third stage for cooling the metal base 20 heated in the second stage, are carried out. In place of solders having different melting points, adding amount of solder having the same melting point may be controlled. COPYRIGHT: (C)2005,JPO&NCIPI
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