发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device of a dual gate type CMOS structure which can efficiently prevent a boron from thrusting through a gate insulating film in a p-MOSFET without encouraging the depletion of a gate electrode even when the film thickness of a gate insulating film is reduced. SOLUTION: The semiconductor device of a dual gate type CMOS structure is provided on a substrate 1 with a p-MOSFET 22 having a p-type polysilicon gate electrode 21, and an n-MOSFET 24 having an n-type polysilicon gate electrode 23. The fluorine concentration in the electrode 21 is 10<SP>17</SP>cm<SP>-3</SP>or less, and the fluorine concentration of a source drain region and the drain region 25 of the p-MOSFET 22 is 10<SP>19</SP>cm<SP>-3</SP>or more. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004319631(A) 申请公布日期 2004.11.11
申请号 JP20030109253 申请日期 2003.04.14
申请人 SHARP CORP 发明人 NAGAI KENICHI
分类号 H01L21/28;H01L21/8238;H01L27/092;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L21/823 主分类号 H01L21/28
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