| 摘要 |
An imaging device (1) comprises a semiconductor imager (5) for transforming an incident light into an electric signal, an optical filter (4) which is arranged opposite to the incident surface of the semiconductor imager (5) and is transparent to a light having a certain wavelength, and a solid substrate (2) for holding the optical filter (4) by adhesive joining using an adhesive (6) containing a filler. The filler has a diameter equal to or less than the pixel size of the semiconductor imager (5). With this constitution, deterioration of image quality caused by the filler coming off of the adhesive can be suppressed in the imaging device (1). |
