SOLDER FILM MANUFACTURING METHOD, HEAT SINK WITH SOLDER FILM WITH DESIRED COMPOSITION AND MELTING POINT, AND SEMICONDUCTOR DEVICE WITH HEAT SINK

摘要

PURPOSE: A solder film manufacturing method, a heat sink with a solder film, and a semiconductor device with the heat sink are provided to obtain desired composition and melting point in the solder film by laminating properly many types of layers. CONSTITUTION: A unit layer is formed by laminating many types of predetermined layers. Each predetermined layer is made of one selected from a group consisting of Zn, Bi, Sn or a predetermined alloy. At this time, the predetermined alloy is made of two selected from a group consisting of Zn, Bi and Sn. A solder film is formed by laminating a plurality of unit layers. Each unit layer is substantially made of Zn, Bi and Sn.