Semiconductor package for use in object e.g. portable telephone, has body that encloses integrated circuit chip presenting optical sensor and installed in interior of object e.g. portable telephone, presenting two parts

摘要

The package has a body that encloses an integrated circuit chip (5) presenting an optical sensor and installed in interior of an object e.g. portable telephone, presenting two parts. A plate having electric connection tracks is disposed in the object. The body has electric connection pins (6) that are supported respectively on the tracks and coupled to the chip. A front support surface of the body couples the two object parts.