发明名称 |
VACUUM THERMAL INSULATION MATERIAL AND DEVICE USING THE SAME |
摘要 |
<p>A vacuum thermal insulation material, wherein the thermally fused layer of a covering material in laminated structure is formed of a film with a melting point of 200 ºC or higher, or the thermally fused layer is formed of a film with a melting point of 100 to 200 ºC and fin parts are bent to low temperature sides, whereby the lowering of gas-barrier properties can be suppressed even in a high temperature atmosphere of approx. 150 ºC. Accordingly, the heat insulating performance of the vacuum thermal insulation material can be maintained for a long period. The vacuum thermal insulation material is suitably used for devices having heat sources exceeding 100 ºC and heat-insulated parts.</p> |
申请公布号 |
WO2004094891(A1) |
申请公布日期 |
2004.11.04 |
申请号 |
WO2004JP04395 |
申请日期 |
2004.03.29 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;TSUNETSUGU, KEISUKE;NAKAMA, HIROTO |
发明人 |
TSUNETSUGU, KEISUKE;NAKAMA, HIROTO |
分类号 |
E04B1/80;G03G15/20;(IPC1-7):F16L59/06;A47J41/00;A47J27/21 |
主分类号 |
E04B1/80 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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