发明名称 VACUUM THERMAL INSULATION MATERIAL AND DEVICE USING THE SAME
摘要 <p>A vacuum thermal insulation material, wherein the thermally fused layer of a covering material in laminated structure is formed of a film with a melting point of 200 ºC or higher, or the thermally fused layer is formed of a film with a melting point of 100 to 200 ºC and fin parts are bent to low temperature sides, whereby the lowering of gas-barrier properties can be suppressed even in a high temperature atmosphere of approx. 150 ºC. Accordingly, the heat insulating performance of the vacuum thermal insulation material can be maintained for a long period. The vacuum thermal insulation material is suitably used for devices having heat sources exceeding 100 ºC and heat-insulated parts.</p>
申请公布号 WO2004094891(A1) 申请公布日期 2004.11.04
申请号 WO2004JP04395 申请日期 2004.03.29
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;TSUNETSUGU, KEISUKE;NAKAMA, HIROTO 发明人 TSUNETSUGU, KEISUKE;NAKAMA, HIROTO
分类号 E04B1/80;G03G15/20;(IPC1-7):F16L59/06;A47J41/00;A47J27/21 主分类号 E04B1/80
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