发明名称 |
Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente |
摘要 |
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening. |
申请公布号 |
DE10297224(T5) |
申请公布日期 |
2004.11.04 |
申请号 |
DE2002197224T |
申请日期 |
2002.08.23 |
申请人 |
DOW CORNING CORP., MIDLAND |
发明人 |
WATSON, MICHAEL JOHN |
分类号 |
C09J11/00;C08L33/00;C08L63/00;C08L79/08;C08L83/00;C09J5/06;C09J9/00;C09J11/08;C09J125/08;C09J163/00;C09J183/04;H01L21/52;H01L21/58;H01L25/065 |
主分类号 |
C09J11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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