| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress the variations of a thickness or a warping and to remove a dummy board easily. <P>SOLUTION: By laminating and forming on a main surface 30a of a flattened dummy board 30, a thin film circuit body 2 in which the variations of the thickness or the warping in the thickness direction are suppressed can be formed. A separation sheet 46 is pasted to the such-formed thin film circuit body 2, and a carrier layer 30b of the dummy board 30 can be peeled off easily and suitably from the thin film circuit body 2 by a separation layer 30c with the separation sheet 46 as a base material. The dummy board 30 can be eliminated without damaging the thin film circuit body 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
