| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor element housing package compatible with miniaturization and excellent in electrical properties at high frequencies, wherein external connection terminals are easily connected to a ceramic substrate, and connection reliability is high in the presence of difference in thermal expansion coefficient between the ceramic substrate and a printed board. <P>SOLUTION: The semiconductor element housing package 10 has a ceramic substrate 11 for mounting a semiconductor element 19 for airtight accommodation. An external connection terminal pad 14 of a conductor pattern formed simultaneously with a ceramic green sheet by baking, and annular protrusions 15 comprising a conductor pattern formed on the external connection terminal pad 14 are provided on one surface of the ceramic substrate 11. External connection terminals 16 are bonded onto the protrusions 15 by a brazing material 18, and are virtually made of spherical metal balls of Cu or a Cu alloy. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
