发明名称 METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board by which the manufacturing accuracy of an inductor to be made within a manufacturing step for the printed wiring board can be improved. SOLUTION: The method for manufacturing a printed wiring board including a process for incorporating inductor element includes a step (a) where a member formed of a semi-cured resin sheet 1 and a metallic foil 2 as an inductor material is used to etch the metallic foil 2, and to form an upper wiring 4 of the inductor or a metallic foil pattern constituting a part thereof; and a step (b) where a printed wiring board 6 provided with at least a lower wiring 5 of the inductor is prepared, a semi-cured resin sheet wherein the metallic foil pattern is formed at such a size or more that the upper wiring 4 and the lower wiring 5 may be covered is cut out while the upper wiring 5 is left, and then the semi-cured resin sheet side is adhered to the lower wiring 5 on the printed wiring board 6 which becomes an inductor. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004311737(A) 申请公布日期 2004.11.04
申请号 JP20030103721 申请日期 2003.04.08
申请人 TOPPAN PRINTING CO LTD 发明人 SEKINE HIDEKATSU
分类号 H05K1/16;H01F41/04;(IPC1-7):H01F41/04 主分类号 H05K1/16
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