发明名称 LASER TRIMMING DEVICE FOR METALLIC FILM, AND METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser trimming device for a metallic film by which a trimming lack part can be formed by burning away a metallic film such as an electrically conductive film without damaging a base material by fire, and the width dimensions of the trimming lack part to be required can be secured, and to provide a method therefor. <P>SOLUTION: A laser beam oscillated from a laser oscillator is divided into two divided beams so as to be reflected by a dividing reflection means. These divided beams are condensed by a condensing means, and an electrically conductive film requiring the formation of a trimming lack part is irradiated therewith to form an overlapped beam 50 from the two divided beams 8C and 8D aligned in an overlapped state in an X direction in the electrically conductive film. The energy of the laser beam in the electrically conductive film is dispersed into the X direction by the divided beams 8C and 8D, and, by the movement of a workpiece provided with the electrically conductive film to a Y direction, the linear trimming lack part with large width dimensions is formed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004306082(A) 申请公布日期 2004.11.04
申请号 JP20030102924 申请日期 2003.04.07
申请人 TEKUNII:KK;UI TECH CO LTD 发明人 UMEDA EIZO;UCHIDA MASATAKA;SATO MASAKO
分类号 B23K26/00;B23K26/06;B23K26/067;B23K26/08;B23K101/36;H01C17/22;(IPC1-7):B23K26/00 主分类号 B23K26/00
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