CHEMICALLY AMPLIFYING POSITIVE PHOTORESIST COMPOSITION FOR THICK FILM, THICK FILM PHOTORESIST LAYERED BODY, METHOD FOR MANUFACTURING THICK FILM RESIST PATTERN AND METHOD FOR MANUFACTURING CONNECTING TERMINAL

摘要

PROBLEM TO BE SOLVED: To provide a chemically amplifying positive photoresist composition for a thick film which has a favorable and stable shape of a product by plating and excellent plating resistance and which is suitable for manufacturing a connecting terminal or the like, and to provide a thick film photoresist layered body, a method for manufacturing a thick film resist pattern by using the above body, and a method for manufacturing a connecting terminal.

SOLUTION: The chemically amplifying positive photoresist composition for a thick film is used to form a thick film photoresist layer of 10 to 150 μm film thickness on a supporting body. The composition contains: (A) a compound which generates an acid by irradiation of active rays or radiation; (B) a resin which increases the solubility with an alkali by the effect of an acid; and (C) an alkali-soluble resin. The (B) component contains (b1) a resin comprising a copolymer containing a structural unit having a specified structure.

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