PROCESSING SYSTEM AND METHOD FOR THERMALLY TREATING A SUBSTRATE
摘要
A processing system and method for thermally treating a substrate, wherein the processing system comprises a temperature controlled thermal treatment chamber, and a temperature controlled substrate holder for supporting a substrate for thermal treatment. The substrate holder is thermally insulated from the thermal treatment chamber.
申请公布号
WO2004082821(A3)
申请公布日期
2004.11.04
申请号
WO2004US07866
申请日期
2004.03.16
申请人
TOKYO ELECTRON LIMITED;HAMELIN, THOMAS;WALLACE, JAY;LAFLAMME, ARTHUR, H., JR.
发明人
HAMELIN, THOMAS;WALLACE, JAY;LAFLAMME, ARTHUR, H., JR.
