发明名称 |
METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE FOR REALIZING FINENESS WITHOUT SHORT BETWEEN SOURCE AND DRAIN REGION |
摘要 |
PURPOSE: A method of manufacturing a non-volatile semiconductor memory device is provided to realize the fineness without the short between a source region and a drain region due to a fine gate electrode. CONSTITUTION: A plurality of gate structures(100) are formed on a main surface(1f) of a semiconductor substrate(1). Each gate structure is composed of a floating gate electrode(8) and a control gate electrode(13) on the floating gate electrode. An interlayer dielectric(41) is formed on the resultant structure. A mask layer(56) is formed thereon. An opening(41h) is formed between adjacent gate structures by etching selectively the interlayer dielectric using the mask layer as an etching mask. A source region(143) is prolonged along adjacent floating gates into the substrate by performing an ion-implantation using the opening.
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申请公布号 |
KR20040092367(A) |
申请公布日期 |
2004.11.03 |
申请号 |
KR20030077891 |
申请日期 |
2003.11.05 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
SHIMIZU SHU |
分类号 |
H01L27/10;H01L21/285;H01L21/768;H01L21/8247;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L27/115 |
主分类号 |
H01L27/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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