发明名称 |
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin |
摘要 |
A semiconductor device comprises: a semiconductor element; an external terminal used for an external connection; an interposer having the semiconductor element mounted on a first surface thereof and having the external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect the semiconductor element and the external terminal; a resin sealing the semiconductor element on the first surface; and an interconnecting portion formed within the resin, the interconnecting portion having a first connecting part electrically connected to the external terminal and having a second connecting part exposed on an outer surface of the resin.
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申请公布号 |
US6812066(B2) |
申请公布日期 |
2004.11.02 |
申请号 |
US20020278940 |
申请日期 |
2002.10.24 |
申请人 |
FUJITSU LIMITED |
发明人 |
TANIGUCHI FUMIHIKO;TAKASHIMA AKIRA |
分类号 |
H01L23/28;H01L21/56;H01L23/12;H01L23/29;H01L23/31;H01L23/552;H01L23/58;H01L25/065;H01L25/07;H01L25/11;H01L25/18;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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