| 发明名称 |
Wiring-connecting material and wiring-connected board production process using the same |
| 摘要 |
The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
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| 申请公布号 |
US2004214979(A1) |
申请公布日期 |
2004.10.28 |
| 申请号 |
US20040846507 |
申请日期 |
2004.05.17 |
| 申请人 |
FUJINAWA TOHRU;YUSA MASAMI;NOMURA SATOYUKI;ONO HIROSHI;WATANABE ITSUO;ARIFUKU MOTOHIRO;KANAZAWA HOKO |
发明人 |
FUJINAWA TOHRU;YUSA MASAMI;NOMURA SATOYUKI;ONO HIROSHI;WATANABE ITSUO;ARIFUKU MOTOHIRO;KANAZAWA HOKO |
| 分类号 |
C08J5/00;C08F283/00;C08F290/06;C08G18/48;C08G18/66;C08G18/81;C08J3/20;C08L51/08;C08L75/04;C09J4/06;C09J9/02;H05K3/32;(IPC1-7):C08G18/00 |
主分类号 |
C08J5/00 |
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