| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique by which gold strike plating can be obviated without deteriorating the adhesion between a metal layer of base nickel or the like and a gold plating layer. SOLUTION: In the direct gold plating method, at the time when noncyanogen based gold electroplating is applied to the surface of a metal conducting layer baser than gold as an electronic element, it is poured into a noncyanogen based gold plating bath, thereafter, power supply is performed in order of nonconducting, conducting at a relatively high current density and conducting at a relatively low current density, and plating is applied thereto. Further, the direct gold plating device is provided with a pretreatment tank, one or more washing tanks, a nickel plating tank, one or more washing tanks, a gold plating tank and one or more washing tanks in this order. A power source for conducting to an anode in the gold plating tank comprises a control means for performing power supply in order of nonconducting, conducting at a relatively high current density and conducting at a relatively low current density. COPYRIGHT: (C)2005,JPO&NCIPI
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