| 摘要 |
A system assembly for the retention of heatsinks, in particular, high-mass heatsinks, is disclosed. The system assembly includes a backplate with standoffs extending transverse to a system board, for securing a heatsink to the system board. The standoffs effectively distribute the mass of the heatsink away from the system board, the processor, and socket, minimizing damage to these components. A TIM spring disposed within the backplate provides upward pressure to the system assembly to uniformly spread a thermal interface material between the processor and the heatsink, thereby facilitating effective heat transfer.
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