| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosetting/thermosetting resin composition which can be developed with an alkaline aqueous solution, has high hardening property in a deep part during exposure, provides high resolution, can form a hardened product having excellent heat resistance, durability against gold plating, adhesiveness and electric insulating property, and contains little component (mist) volatilized from the solder resist composition in the processes of predrying along with heating, of exposing, thermosetting and soldering. <P>SOLUTION: The resin composition contains: (A) a carboxyl group-containing resin having one or more carboxyl groups in one molecule; (B) a titanocene-based photopolymerization initiator; (C) a photopolymerization initiator excluding the titanocene-based photopolymerization initiator (B); (D) a diluent; and (E) an epoxy compound having two or more epoxy groups in one molecule. The compounding amount of the titanocene photopolymerization initiator (B) is 0.01 to 0.4 part by mass with respect to 100 parts by mass of the carboxyl group-containing resin (A). By using a minute amount of the titanocene-based photopolymerization initiator (B) and another photopolymerization initiator (C) together, a hardened coating film having excellent hardening property in a deep part and excellent durability against electroless gold plating or the like in a thick film can be formed without spreading to the back face during simultaneous double-face exposure. Therefore, a printed wiring board with high reliability can be efficiently produced at a low cost. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
