Film carrier tape for mounting an electronic part, process for producing the same, and screen for solder resist coating

摘要

A film carrier tape for mounting an electronic part, comprising an insulating film, a wiring pattern formed on a surface of the insulating film and a solder resist layer formed on the wiring pattern except connecting lead portions of the wiring pattern, wherein the solder resist coating thickness at the edge portion of the solder resist layer is continuously decreased toward the tip of the edge portion. The film carrier tape for mounting an electronic part can be produced by applying a solder resist coating solution onto the wiring pattern using a screen in which opening sizes at the edge portion of a coating solution passing zone are reduced stepwise or continuously or by applying a solder resist coating solution onto the wiring pattern with pressing a film carrier against the screen so as to decrease a coating weight of the solder resist coating solution continuously or stepwise toward the tip of the edge portion of the resulting solder resist layer. Also disclosed is a screen for solder resist coating, comprising a gauze having an area in which opening sizes are changed stepwise or continuously.