| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a conventional module substrate can not be easily manufactured since a lead terminal soldered to a mother board is provided with a special configuration exclusive for the module substrate. SOLUTION: The module substrate 20 is provided with a main substrate 22 on both sides of which a plurality of electronic components 21a and electronic components 21b are mounted by soldering, and four pieces of substantially rectangular parallelepiped sub substrates 23 mounted on the outer periphery of the main substrate 22 by soldering, while resin 27 is applied on a part surrounded by the sub substrates 23 so as to cover the electronic components 21b. According to this constitution, the module substrate can be easily manufactured without necessitating any special lead and the substrate can be mounted on the mother board by an automatic machine. COPYRIGHT: (C)2005,JPO&NCIPI
|
