发明名称 CURABLE COMPOSITION
摘要 <p>A curable composition characterized by comprising a polyoxyalkylene polymer having a reactive silicon group which polymer is obtained by reacting a polyoxyalkylene polymer (A) having a molecular weight distribution of 1.6 or below and a number-average molecular weight of 15,000 to 50,000 and containing on average 0.8 or more reactive group in the molecule with an organic compound (B) having both a reactive silicon group and a functional group reactive with the reactive group of the polymer (A) in a proportion of 0.8 to 1.5 molecules on average per molecule of the polymer (A), a filler (C), and a curing catalyst (D), in which the content ratio (y/x) is 0.4 or below wherein x is the content(wt%) of the liquid components which are contained in the composition and each have at least one reactive silicon group and y is the content (wt%) of the liquid components which are contained in the composition and are free from reactive silicon groups and the plasticizer content is at most 10 parts by weight per 100 parts by weight of the polyoxyalkylene polymer having a reactive silicon group. This composition is excellent in applicability and can give cured bodies excellent in stain resistance, thus being useful as sealant.</p>
申请公布号 WO2004092270(A1) 申请公布日期 2004.10.28
申请号 WO2004JP04481 申请日期 2004.03.29
申请人 KANEKA CORPORATION;FUJIMOTO, TOYOHISA 发明人 FUJIMOTO, TOYOHISA
分类号 C08G65/336;C09K3/10;(IPC1-7):C08L71/02 主分类号 C08G65/336
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