发明名称 LEAD SHEARING DEVICE
摘要 PROBLEM TO BE SOLVED: To allow lead materials to be sheared without leaving burrs on shearing tips. SOLUTION: An upper blade groove D2 and a lower blade groove D1 are formed, respectively, so as to be opposed to each tip of a lower blade 51 and an upper blade 52 where chips are easy to adhere at a shearing operation position S2. Thus, whenever one shearing operation is performed, the chips which have adhered to the tips can be scraped. Thus, even if shearing operation is repeated and frictional heat is generated, the chips do not harden, do not accumulate and do not adhere to the tips. The occurrence of a gap between abutting surfaces can be prevented, and degradation in the accuracy of shearing can be prevented even if shearing operation is repeated, and thus the lead materials can be sheared without leaving burrs on the shearing tips. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004303626(A) 申请公布日期 2004.10.28
申请号 JP20030096731 申请日期 2003.03.31
申请人 SONY CORP 发明人 WATANABE KYOICHI
分类号 H01M2/26;H01M4/04;(IPC1-7):H01M4/04 主分类号 H01M2/26
代理机构 代理人
主权项
地址