发明名称 Implantable medical device conductor insulation and process for forming
摘要 A composite redundant insulation is formed about each of a plurality of conductors extending within a lead body of an implantable medical device. The insulation includes a first insulative layer, a second insulative layer having a lower durometer and a lower flexural modulus than the first insulative layer, and a third insulative layer having a higher durometer and a higher flexural modulus than the second insulative layer.
申请公布号 US2004215299(A1) 申请公布日期 2004.10.28
申请号 US20030421182 申请日期 2003.04.23
申请人 MEDTRONIC, INC. 发明人 ZHAO YONG DAVID;SOMMER JOHN L.
分类号 A61N1/05;(IPC1-7):A61N1/05 主分类号 A61N1/05
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