| 摘要 |
<p>PROBLEM TO BE SOLVED: To ensure pickup of a semiconductor chip by a die bonding machine without giving damages on the semiconductor chip. SOLUTION: A die bonding machine in which a semiconductor chip 11 adhered to an adhesive sheet 12 is thrust up from the backside of the adhesive sheet 12 to be peeled off by using an thrust pin 28, and the semiconductor chip 11 is bonded on a lead frame. The machine comprises load measurement means 21, 22 for measuring a thrust load acting to the semiconductor chip 11 accompanied by a thrust operation of the thrust pin 28, and a controller 24 selecting continuance or stop of the thrust operation by the thrust pin 28 and executing it based on whether the measured value by the load measurement means 21, 22 exceed the allowable value or not.</p> |
