Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board,申请号EP20020258728-传众专利搜索

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发明名称	Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board
摘要
申请公布号	EP1321215(A3)	申请公布日期	2004.10.27
申请号	EP20020258728	申请日期	2002.12.18
申请人	SENJU METAL INDUSTRY CO., LTD.;KTT CO. LTD.	发明人	TAKAGUCHI, AKIRA;WATA, MASAKI;NUMATA, CHIKARA
分类号	B23K1/08;B23K1/20;B23K3/06;B23K3/08;B23K101/42;H05K3/34;(IPC1-7):B23K1/08	主分类号	B23K1/08
代理机构		代理人
主权项
地址

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