METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING FIRST AND SECOND MOVABLE PLATES

摘要

PURPOSE: A method of manufacturing a semiconductor device is provided to secure electrical connection between a second electrode of a semiconductor chip and a first electrode of a substrate by pressing the semiconductor chip downward using a first movable plate and a second movable plate. CONSTITUTION: A plurality of first electrodes(3) are formed on a substrate(2). A sealing resin(4) is coated on the substrate except the first electrodes. A semiconductor chip(6) with a plurality of second electrodes(7) corresponding to the first electrodes is provided. The first and second electrodes are connected with each other by pressing end portions of the chip using a first movable plate(8a). The sealing resin is filled in a gap between the chip and the substrate by pressing the center of the chip using a second movable plate(8b).