发明名称 Process for massively producing tape type flexible printed circuits
摘要 A process for massively producing tape type flexible printed circuits is provided. The steps of pressing, etching and insulating are executed on a flexible insulation tape in reel-to-reel fashion. Thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the sprocket holes arrange on to become several winds of narrower flexible circuit tapes. Each flexible circuit tape has tape type flexible printed circuits and sprocket holes at two sides.
申请公布号 US6808866(B2) 申请公布日期 2004.10.26
申请号 US20020135357 申请日期 2002.05.01
申请人 MEKTEC CORPORATION 发明人 HUANG JUNG-CHOU;SU WEN-YANN;PANG KUEI-HAO;LO GROW-HAO;CHU CHE-HUI
分类号 H05K1/00;H05K3/00;H05K3/02;H05K3/06;H05K3/28;(IPC1-7):G03F7/00 主分类号 H05K1/00
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