HEAT SINK STRUCTURE OF SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF TO REDUCE POSSIBILITY OF TRACK

摘要

PURPOSE: A heat sink structure of a semiconductor device is provided to reduce a possibility of a track by forming liquid ceramic material on a substrate and a semiconductor chip such that the liquid ceramic material are independent of each other and by concentrating stress even if the liquid ceramic material are exposed. CONSTITUTION: A semiconductor chip(6) is formed on a substrate(12). Liquid ceramic material(13) are formed on the upper surface of the substrate and on the upper surface of the semiconductor chip wherein the liquid ceramic materials are independent of each other. A slit is formed in the liquid ceramic material.