Process and apparatus for packaging a tape substrate

摘要

A process and apparatus for packaging a tape substrate are provided. A first chip is encapsulated to a first side of a tape substrate to form a first capsule in a first segment of the tape substrate. The first segment of the tape substrate is secured to a first clamping element. A second segment of the tape substrate adjacent the first segment is secured to a second clamping element. At least one of the first segment and the second segment is moved to stack the second segment over the first capsule. The first clamping element and second clamping element can move independently of each other.