| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board of high reliability which realizes reliable fine interlayer connection and can form a fine wiring pattern. SOLUTION: The multilayer wiring board is provided with a conductor circuit having a conductor post for interlayer connection, and a pad for connection with the conductor post 107, a metal layer 108 for connection which is used for connecting the conductor post with the pad, and insulating layers existing between layers. The insulating layer is constituted of a metal bonding adhesive (I) layer 109 and an interlayer insulator (II) layer 105, which is constituted by making cyanate compound inevitable component. The metal bonding adhesive (I) layer consists of component which does not contain cyanate compound. The conductor post, the pad and the metal material layer are connected in the metal bonding adhesive (I) layer. COPYRIGHT: (C)2005,JPO&NCIPI |
