ALUMINIUM PAD POWER BUS AND SIGNAL ROUTING OF INTEGRATED CIRCUIT DEVICE USING INTERCONNECTION STRUCTURE OF COPPER TECHNOLOGY TO FORM INTEGRATED CIRCUIT DEVICE STRUCTURE IN ALUMINIUM PAD OR CONTACT LAYER

摘要

PURPOSE: An integrated circuit device using an interconnection structure of a copper technology is provided to form an integrated circuit device structure in an aluminium pad or a contact layer by including a bond pad level having a plurality of contact pads and an interconnection part. CONSTITUTION: An integrated circuit device is prepared in which a multilevel metallization interconnection system including a bond pad level and at least one underlying interconnection level is formed on a semiconductor substrate. The bond pad level includes a plurality of contact pads and an interconnection part. The plurality of contact pads are constituted to be connected to the outside of each device. The interconnection part is constituted to transfer power from at least one of the plurality of contact pads to at least one of the underlying interconnection level.