发明名称 |
Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
摘要 |
An integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board. One embodiment according to the present invention is a method for fabricating an integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board, both surfaces of the first and second electrodes having an adhesive tendency to molten metal, the method comprising the steps of forming a metal bump on the first electrode, the metal bump being made of a soldering metal alloy consisting of a solid phase component and a liquid phase component at an operating temperature; and forming an electric connection between the first electrode and the second electrode by heating the soldering metal alloy so as to adhere to the surface of the second electrode. |
申请公布号 |
US2004209453(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
US20040847614 |
申请日期 |
2004.05.18 |
申请人 |
FUJITSU LIMITED |
发明人 |
AKAMATSU TOSHIYA;KARASAWA KAZUAKI;NAKANISHI TERU;SHIMIZU KOZO |
分类号 |
B23K35/26;H01L21/60;H01L23/485;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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