| 摘要 |
PROBLEM TO BE SOLVED: To provide the optical curing method of an adhesive tape for circuit transferring, wherein the adhesive power of an adhesive agent for adhesive tape is degraded to transfer a circuit pattern to an insulating substrate without disturbing the pattern, and the manufacturing method of a circuit substrate capable of transferring the circuit pattern to the insulating substrate without disturbing the pattern, since the adhesive agent of the adhesive tape will not be adhered to the insulating substrate so strongly and excellent in a manufacturing efficiency. SOLUTION: The optical curing of the adhesive tape for circuit transferring is effected by irradiating light, whose maximum irradiation strength in a wavelength 365 nm is not less than 50 mW/cm<SP>2</SP>against the adhesive tape for circuit transferring. The tape is laminated with circuit pattern consisting of a metal foil on the adhesive surface of the adhesive tape consisting of an optically curing adhesive agent layer containing an optical radical polymerizing constituent, and laminated on the resin film substrate to cure the light curing adhesive agent. The circuit substrate is manufactured by a method wherein the optically curing adhesive agent layer is cured by the optical curing method of the adhesive tape before separating the resin film substrate of the adhesive tape and the adhesive agent layer from the circuit pattern. COPYRIGHT: (C)2005,JPO&NCIPI
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