发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To relax a stress being applied to an electronic component arranged while crosslinking from conductor to conductor. SOLUTION: A first conductor (1) and a second conductor (2) have notched surfaces (6), respectively, inclining downward toward the approaching direction. Each electrode (8) of an electronic component (3) arranged while crosslinking the first conductor (1) and the second conductor (2) is bonded to the notched surfaces (6) by a metallic adhesive (5) formed of a metal having a modulus of longitudinal elasticity lower than that of the first conductor (1) and the second conductor (2) and having a lower adhesive (5a) formed thickly between the bottom face (8c) of the electrode (8) and the notched surface (6) from the corner part (8a) to the inner end part (8b) of the electrode (8). A mechanical stress being transmitted to the electronic component (3) is relaxed and attenuated well by cushion action of the lower adhesive (5a) thus preventing the electric characteristics of the electronic component (3) from deteriorating. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004296624(A) 申请公布日期 2004.10.21
申请号 JP20030084956 申请日期 2003.03.26
申请人 SANKEN ELECTRIC CO LTD 发明人 YOKOYAMA TAKAAKI;INOUE NOBUO;MAEJIMA NORIO
分类号 H01C1/01;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01C1/01
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