发明名称 Conductor substrate, semiconductor device and production method thereof
摘要 A conductor substrate for mounting a semiconductor element, at least a portion thereof mounting the semiconductor element being sealed with an insulating resin, wherein an uppermost surface layer of the conductor substrate comprises copper or an alloy thereof, and the conductor substrate is partly or entirely covered with a layer of copper oxide containing a hydroxide formed upon the surface treatment of the conductor substrate and a process of producing the conductor substrate as well as a process for the production of a semiconductor device using the conductor substrate.
申请公布号 US2004207056(A1) 申请公布日期 2004.10.21
申请号 US20040824523 申请日期 2004.04.15
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 SEKI KAZUMITSU;MIYAHARA YOSHIHITO;KURE MUNEAKI
分类号 C25D11/34;C23C22/63;H01L23/495;H01L23/50;H05K3/20;H05K3/38;(IPC1-7):H01L21/48;H01L23/52 主分类号 C25D11/34
代理机构 代理人
主权项
地址