发明名称 Semiconductor device having a roughened surface electrode and method of manufacturing the same
摘要 An opening is defined in an interlayer insulating film, and an amorphous silicon film is formed on the opened interlayer film. Silicon growth nuclei are formed on the amorphous silicon film. The silicon growth nuclei are heat-treated to form a surface-roughened polycrystallized silicon film so that surface roughness of a reverse side of a silicon growth nuclei forming surface increases. The polycrystallized silicon film on the upper surface of the interlayer film is removed to form a concave surface-roughened cylinder. The interlayer film is removed to form a cylindrical surface-roughened electrode
申请公布号 US2004206998(A1) 申请公布日期 2004.10.21
申请号 US20030646762 申请日期 2003.08.25
申请人 RENESAS TECHNOLOGY CORP. 发明人 ANMA MASATOSHI
分类号 H01L21/02;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L21/02
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