| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can be maintained in a highly reliable state due to the high joint strength between laminated semiconductor chips, and to provide the semiconductor device and electronic equipment equipped with the device. <P>SOLUTION: Holes H3 having almost equal widths are formed in the whole body of a substrate 10 having an active surface 10a on which an electronic circuit is formed by performing anisotropic etching on the substrate 10 from the active surface 10a side. Then the bottom surfaces of the holes H3 are curved without widening the widths of the holes H3 by performing isotropic etching. Thereafter, connecting terminals are formed by embedding a metal in the formed holes H3, and the connecting terminals formed by embedding the metal in the holes H3 are partially exposed from the rear surface of the substrate 10 by etching the rear surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
