| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electron source substrate manufacturing device capable of stably manufacturing an electron source substrate with an electron emission element of high quality, high accuracy and high reliability without plugging during injection. <P>SOLUTION: This electron source substrate manufacturing device forms the surface conductive electron emission element by injecting a solution for forming a conductive thin film 4 between element electrodes 2, 3 on a substrate 1, by a liquid droplet injection head with a discharge port diameter ofΦ25μm or less. Metal particles are dispersed in the solution for forming the conductive thin film 4, and the metal particles are formed of a material softer than a member for forming a discharge port. When the size of the metal particle is made Dp and the discharge port diameter is made Do, 0.0001≤Dp/Do≤0.01 is to be satisfied. An electron emission part 5 of the surface conductive electron emission element is formed of a dot pattern of the solution, and the end parts of the dot pattern are electrically connected to the element electrodes 2, 3. Injection is controlled to place dots one on top of another a plurality of times at the edge parts of the element electrodes 2, 3 in the connection regions. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
