| 摘要 |
PROBLEM TO BE SOLVED: To achieve higher density than in a conventional technique in a printed wiring board by reducing a dead space between adjacent printed wiring boards which is caused by lands. SOLUTION: In a printed wiring board 10, the area of each of copper lands 20 to which terminals 22A of an electric component 22 is soldered is made smaller than the area of each of the terminal portions. With this configuration, the distance between the printed wiring board 14 and a printed wiring board 16 adjacent to the printed wiring board 14 is made smaller, and the high density of the printed wiring board can be achieved. COPYRIGHT: (C)2005,JPO&NCIPI
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