发明名称 Camera module and manufacturing method thereof
摘要 A camera module for a mobile device is reduced in size and manufacturing cost. A filter material made of a multi-layer thin film is bonded to a surface of a lens which is bonded to a surface of an image sensor chip. The filter material is a filter to block radiation within a predetermined range of wave length in an incident radiation to the lens, for example, an IR filter to block infrared radiation. An iris material made of a film such as an acrylic film or a polyolefin film is bonded to the lens covered with the filter material.
申请公布号 US2004207036(A1) 申请公布日期 2004.10.21
申请号 US20040771513 申请日期 2004.02.05
申请人 SANYO ELECTRIC CO 发明人 IKEDA OSAMU
分类号 G02B7/02;G02B3/00;G02B5/28;H04N5/225;H04N5/335;H04N5/372;(IPC1-7):H01L31/023 主分类号 G02B7/02
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